Imodeli Yomshini Wokuhlanganisa Ama-Chip e-RFID: Isithombe Esivelele se-ST-FC180

Imodeli Yomshini Wokuhlanganisa Ama-Chip e-RFID: ST-FC180

Izincazelo Ezijwayelekile

I-RFIDImodeli Yomshini Wokuhlanganisa Ama-Chip: ST-FC180
Umshini wokubopha ama-chip we-RFID ozenzakalelayo ogcwele usetshenziselwa i-HF、UHF chip bonding, ububanzi bewebhu ye-substrate (isiqondiso se-CD) kufika ku-200MM, umshini uhlanganiswe ne-antenna ukuphumula, i-glue dispense, i-die attach, i-hot press, i-QC verification, i-inlay dot embi, njll. imisebenzi, i-wafer disk engu-8 no-12 intshi iyahambisana, i-wafer disk engu-6 intshi idingangokwezifisokwenziwe.

Xhumana Nathi Manje Ukuze Uthole Amasampula !!!

Sithumelele i-imeyili

info@focusrfid.com

+8618560195575

Imininingwane Yomkhiqizo

Amathegi Omkhiqizo

Isingeniso

1. Le mishini ekhethekile yenzelwe ukukhiqizwa kwe-RFID inlays kanye ne-chip bonding. Ifaneleka kakhulu ekuhlanganisweni kwe-flip-chip okunomugqa owodwa kwemikhiqizo ene-antenna engacacile noma ecacile kancane (njenge-antenna ye-PET esekelwe ephepheni noma engacacile).
2. Isebenzisa uhlelo lokubona umbono oluyinkimbinkimbi, umshini ukhomba futhi uthole ngokunembile ama-chip amancane—anikezwa ngamathreyi—kanye nama-antenna aguquguqukayo; kamuva, ama-actuator asheshayo nanembile enza ukubopha okunembile kwama-chip kuma-antenna.

Izici

Ifanele i-PET, i-antenna yephepha;
Ububanzi bezinto ezingaphansi komhlaba：30 ~ 200mm, ukujiya:≥50μm, indawo yokunamathisela ye-antenna iphakathi nendawo;
Wubukhulu bediski elingemuva: 8 no-12 intshi,
Wusayizi ongaphezulu: 0.35*0.3mm kuya ku-3*3mm phakathi nalolu hlu;
Tubukhulu be-wafer: 0.075-0.16mm;
Iglue: I-ACP iyamukeleka, i-NCP: ayikaqinisekiswa okwamanje;
Pumkhawulo wokulunywa ku-axis ye-X ne-Y:ubuncane15mm, ubuningi obungu-240mm (phawula: iphimbo kumele libe yinombolo ephindaphindayo ephakathi kuka-157 no-240mm)

Ukucaciswa Kobuchwepheshe

#	Ipharamitha	Inani
1	Ubukhulu	L6000W1300H1750 (mm)
2	Isisindo	Cishe ama-2000 kg
3	I-Voltage Elinganisiwe	Isigaba sesithathu, i-AC380V
4	Amandla Alinganisiwe	Cishe i-16 KW
5	Ukucindezela Komoya	0.6 ~ 0.8 MPa
6	Ukusetshenziswa Komoya	Cishe i-100 L/MIN
7	Inombolo Yomqhubi	Umuntu ongu-1
8	Uhlobo Lokulawula	PC
9	Uhlelo Lokusebenza	Win 10
10	I-UPH	Iphimbo 25mm: 15000 ama-pcs/h
		Iphimbo 50mm: 7500 ~ 8000 ama-pcs/h
		Iphimbo 150mm: 2600 ama-pcs/h
11	Veza	99.70%
12	Umsindo	≤85 DB
13	Ukunemba Kokunamathisela Kwe-Die	±0.05 mm
14	Izinto Zokusebenza	I-inlay eyomile eyodwa
15	I-substrate	I-PET, iphepha; ukujiya: ≥0.05 mm
16	Ushintsho Ngokuhamba Kwesikhathi — Ushintsho Oluphelele Lomkhiqizo (i-antenna ne-chip futhi mhlawumbe i-ACP/NCP)	Cishe imizuzu eyi-150
17	Ushintsho Ngokuhamba Kwesikhathi — I-Wafer/I-Chip Kuphela	imizuzu emi-5